Sulfamate Nickel Plating

Sulfamate Nickel is a plating application with exceptionally low tensile stress, which is the ideal characteristic for electroforming alongside other engineering applications. The purity, corrosion protection, dimensional buildup and resistance to high temperatures make it an ideal plating application for engineering components. Sulfamate Nickel uses a 99.9% pure nickel deposit unlike the standard nickel sulfate, which enhances the surface durability.

Sulfamate Nickel can be used for subsequent plating as a barrier layer for Tin, Silver, and Gold plating to improve corrosion resistance and inhibit Copper migration on Copper Alloys.

To learn more about our sulfamate nickel plating application, contact us today!

 

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